Description
Lead free no-clean wire solder developed with a unique no-clean flux system specifically for high temperature lead free alloys. Utilizing synthetically refined resin and a very effective activator, the solder wets and spreads beautifully. Exhibits virtually no spattering.
Diameter: .032″
Net Volume: 11 grams
Contents: 96.5%Sn, 3.0%Ag, 0.5%Cu
Melting Range: 422°F-430°F
RoHS Compliant: Yes
Conforms to J-STD-004, REL0.
